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Korea develops roll-based packaging for flexible silicon ICs

Korean process engineers have developed a chip packaging technology that creates flexible integrated circuits. The process starts with a flash memory wafer diced after thinning to ~100nm. These die are attached to a plastic carrier film, which allows them to be transferred to a roller and pressed onto a flexible PCB supported by a flat plate. The team suggests tolerance control is such that multiple die can simultaneously be applied to multiple PCBs by a single roller.

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